KARE TECHNOLOGIES
KARE TECHNOLOGIES
  • Home
  • TECHNOLOGIES
  • Healthcare
  • PRODUCTS
  • Contact Us
  • More
    • Home
    • TECHNOLOGIES
    • Healthcare
    • PRODUCTS
    • Contact Us
  • Home
  • TECHNOLOGIES
  • Healthcare
  • PRODUCTS
  • Contact Us
THINGWORX (IOT SOFTWARE)Acoustics SimulationAnsys Fluent (Fluid Dynamics)SemiconductorsAnsys ElectronicsAnsys Optics

INTERNET OF THINGS (IOT)

Build a better IIoT solution with ThingWorx

Industrial companies face pressing challenges that require IIoT solutions. To address a wide range of manufacturing, service, and engineering use cases, PTC has spent years innovating the ThingWorx IIoT platform.

From service to workforce efficiency and asset optimization, ThingWorx solves common challenges across different industries. 

Because building Industrial IoT solutions is often cited as a pain point, ThingWorx is designed to reduce these barriers. Cruise from pilots to enterprise-scale solutions, using pre-built applications and developer tools.

 Maximize your IIoT potential 

 ThingWorx simultaneously removes the technical barriers to IIoT implementation, while emphasizing practical solutions that quickly return value. 

  

Maximize revenue

Scale to new markets, improve throughput, and unlock new business models such as products as a service.

 

Accelerate innovation

Get to market faster using a rich set of industrial IoT capabilities. Wrap and extend existing assets within your connected solution.

 

Reduce costs

Leverage data from connected products and systems to increase productivity, lower cost, and increase efficiency.

 

Improve quality

Make product, service, and factory operations more secure and scalable. Improve service quality, reliability, and satisfaction.

 

Maximize flexibility

Take control of your deployment options with on-premise, cloud, or a hybrid approach. Flexibly support any industrial use case.

Acoustics Simulation

Acoustic Analysis and Sound Design

 Acoustics Simulation

All product designers and engineers must consider the noise a product will generate as an increasingly important factor. This applies whether the product is designed to create noise, such as a hearing device or speaker, is intended to dampen noise such as a muffler, or has potential to create noise as an unexpected by-product through turbulence, friction or structural vibration.

Best-in-class companies are now bringing forward their assessment of a product’s acoustic performance, rather than run the risk of facing a costly build-and-test scenario later in the design stage. By utilising Ansys acoustics simulation techniques to analyse designs early in the design process with a virtual prototype, engineers can significantly reduce production lead times and avoid costly re-engineering processes.

 

Ansys VRXPERIENCE SOUND

With Ansys VRXPERIENCE Sound, you can listen to, analyze and design sound sources. Create immersive 3D soundscapes to enhance your product or your simulations based on recordings, CAE simulation outputs or your virtual reality (VR) environment. Acoustics analysis can be performed in several ways, either as a pure acoustic problem, or as a coupled vibro acoustic problem.

Sound Analysis and Sound Quality
VRXPERIENCE Sound offers a powerful suite of analysis tools focusing on sound perception. An intuitive graphic display of sounds and a one-click magnification control feature help create the perfect sound signature for your product. With the software, you can also set up psychoacoustic tests based on a listener panel, and obtain statistics about the real perception of your sounds. As a result, you can achieve and deliver the best sound.

You can also evaluate and improve the way a sound is perceived, by using tools based on time-frequency representations.

3D-Sound Playback Systems
VRXPERIENCE Sound uses state-of-the-art 3D recording and playback techniques that create high-precision reproductions of 3D sounds and original timbres in a predefined space. You will discover how sound perception maximizes immersion in a specific real or virtual place.

Interactive Audio Simulators
VRXPERIENCE Sound systems are specially designed to equip your simulators and VR platforms. Available for cars, aircraft and trains, they create realistic, interactive 3D soundscapes using real-time audio sound generation, which can be integrated with your simulators and platforms.

Engine Sound Design
VRXPERIENCE Sound provides the Active Sound Design (ASD) comprehensive solution for engine sound enhancement (ESE) for electric vehicles (EVs) and internal combustion engine (ICE) cars.

Listen to Mechanical and Fluids Simulations
With VRXPERIENCE Sound, you can listen to Ansys Mechanical, Ansys Fluent, Ansys LS-DYNA and Ansys Motion simulations, modify sounds to evaluate effects of level changes on components, and run a study on sound quality. To learn more about VREXPERIENCE Sound.


 

Quick Specs

Define meaningful vibro-acoustic specifications, targets, and acceptance thresholds using Ansys Sound's powerful post-processing capabilities. Special tools are dedicated to E-Motor noise, aeroacoustics sources, virtual reality 3D sound, and more.

 

  • Sound Analysis and Playback
  • Psychoacoustics and Sound Quality
  • Immersive Driving Simulator Sound
  • E-motor sound optimization
  • Harmonic Exploration
  • Listening Tests for Sound Perception
  • Engine Sound Design
  • Multiphysics Acoustic CAE Sound Rendering
  • High Accuracy Spatial Sound
  • Active Sound Design for EV


What's New in Acoustics Analysis

Mechanical Sound Analysis and Specification

 Ansys Sound Analysis and Specification (SAS) is now available to all Mechanical Enterprise users. It allows them to perform acoustic analyses quickly, listen to the results of CAE NVH simulation, and create quieter or more pleasing sounds for their products. 

Data Processing Framework Updates

 Ansys Sound Data Processing Framework (DPF Sound) now includes the leading psychoacoustics indicators (loudness, tonality, sharpness, etc.), allowing users to use libraries for their development or scripts to estimate how humans perceive sound. 

Virtual Reality 3D Sound Player Updates

 Ansys Sound Virtual Reality 3D Sound Player (VRS) now includes video and image displays, providing users with enhanced immersion and realism. This enhancement allows users to play a 3D sound and display a synchronized video or image. 

Acoustics Simulation Capabilities

Listen to and Analyse Sound Quality

Listen to and Analyse Sound Quality

 Based on real test measurement or acoustic CAE simulation, listen and separate the sound sources, to then analyse the sound and improve the sound quality. 

Optimise Engine Sound for E-Motor

Listen to and Analyse Sound Quality

 E-motor optimisation means you can simulate the noise radiated by the e-motor and optimise designs according to acoustic KPI or sound quality criteria.  

Listen to Mechanical and Fluids Simulations

 Through vibro-acoustic and CFD simulations, you can listen to the sound of your virtual prototype and optimise the acoustic performance and sound quality at the beginning stages of the design process.  

Evaluate Sound Perception with Jury Testing

From Component-level Acoustic Simulation to System-level Sound Rendering

 Along with qualitative testing, acoustic design includes real-world perception—something Ansys evaluates with jury testing tool, with several psychoacoustic methods including statistical analysis. 

Active Sound Design for Automotive

From Component-level Acoustic Simulation to System-level Sound Rendering

From Component-level Acoustic Simulation to System-level Sound Rendering

 Active Sound Design technologies can create an atmosphere to make the vehicle more alive, more attractive and safer thanks to audio feedback while driving. This is used for ICE engine cars and EV, including AVAS and ADAS sound.  

From Component-level Acoustic Simulation to System-level Sound Rendering

From Component-level Acoustic Simulation to System-level Sound Rendering

From Component-level Acoustic Simulation to System-level Sound Rendering

 Combining simulation results, lab measurements recordings and acoustic transfer path, you can listen to your product and each of the components of your system in a fully realistic environment, like a driving or flight simulator. 

ANSYS FLUENT

Fluid Simulation Software

 Ansys Fluent gives you more time to innovate and optimize product performance. Trust your simulation results with a software that has been extensively validated across a wide range of applications. With Ansys Fluent, you can create advanced physics models and analyze a variety of fluids phenomena—all in a customizable and intuitive space. 

 

Quick Specs

Accelerate your design cycle with this powerful fluid simulation software. Ansys Fluent contains the best-in class physics models and can accurately and efficiently solve large , complex models.

 

  • Task-Based Workflows
  • Turbulence Modeling
  • Single and Multiphase Flows
  • Reduced Order Models
  • Expressions
  • Acoustics
  • Combustion
  • Shape Optimization
  • Overset Mesh
  • Conjugate Heat Transfer
  • Fluid-Structure Interaction
  • HPC

What's New in Ansys Fluent

Fluent GPU Solver Enhancements

 New enhancements to the GPU solver in 2024 R1 include new models and physics capabilities, including support for the Coupled Solver, non-conformal interfaces, sliding mesh, combustion with detailed and stiff chemistry, enhanced solution monitors and more. 

Fluent CPU Solver Enhancements

 New modeling and physics enhancements include the stiff chemistry solver and the eddy dissipation concept model compatibility with the adjoint solver, 10-20% speed-up for conjugate heat transfer (CHT) calculations for applications with high solid-to-fluid mesh count ratios, and discrete phase modeling for multi-phase flows, coupling, and radiation sources. 

New Fluent Web Interface

Fluent Updates for Aerospace Applications

 A new Fluent web-based UI that allows users to access their simulations remotely via a web browser is now available. The web UI is a modern yet familiar interface that enables users to start, stop, and pause solver jobs to evaluate real-time results as calculations run. Available for solution controls, monitoring, and post-processing.  

Fluent Updates for Aerospace Applications

Fluent Updates for Aerospace Applications

Fluent Updates for Aerospace Applications

 Aerospace application updates include accuracy improvements to the two-temperature equation model for high-speed flight regimes that now match better with measured data. The Virtual Blade Model (VBM), widely used for rotorcraft and urban air mobility applications, now includes additional outputs, including Xp-force and Yp-force. 

PyFluent Improvements

Fluent Updates for Aerospace Applications

AI/ML for Turbulence Modeling

 PyFluent updates include an improved workflow interface for a cleaner and more efficient programming style, new API availability to access and modify volumetric solution data, and usability improvements of field-data APIs with a purpose-designed interface for more straightforward interpretation. 

AI/ML for Turbulence Modeling

Fluent Updates for Aerospace Applications

AI/ML for Turbulence Modeling

 Turbulence model tuning with AI/ML is now available. The adjoint solver and AI/ML calibrate GEKO coefficients against a high-fidelity LES solution, yielding LES-level accuracy at the cost of RANS. 

Semiconductors

Multiphysics Analysis Solutions for Chips and 3D IC Systems

 

Create Reliable and Efficient Designs With Production-Proven Multiphysics Analysis

 Ansys cloud-native solutions provide unparalleled capacity to speed up completion times for even the largest finFET integrated circuits (IC) and 3D/2.5D multi-die systems. These powerful multiphysics analysis and verification tools reduce power consumption, improve performance and reliability, and lower project risk with foundry-certified golden signoff verification. 

Features

  • Power integrity (EM/IR) analysis and modeling with RedHawk-SC for digital, and Totem-SC for analog designs
  • Electrothermal analysis of 2.5D/3D multi-die systems
  • Variability-aware path timing with Path FX
  • Electrostatic discharge (ESD) and reliability analysis with PathFinder-SC
  • RTL power analysis and reduction with PowerArtist
  • On-silicon electromagnetic analysis and modeling with RaptorH, Pharos, Exalto, and VeloceRF
  • Cloud-native elastic compute architecture for full-chip capacity

Ansys Semiconductors

This video briefly overviews the challenges and solutions addressed by Ansys Semiconductor software products for the Electronic Design Automation (EDA) market. Semiconductor design is going through an inflection point as designers face two significant challenges rooted in manufacturing advances: The first is the ongoing march of Moore’s Law into advanced finFET process technology below 5nm. We see newtransistor architectures like nanosheet gate-all-around (GAA) and back-side power delivery.The second set of challenges facing semiconductor designers relates to multi-die design, 2.5D/3D-IC packaging, and heterogeneous integration. Leading design teams have adopted these advances as they face various novel multiphysics challenges to succeed with 3D-IC. New multiphysics challenges include

  • Thermal analysis and prototyping
  • .Electromagnetic coupling (EMC/EMI) of interposer signals, even digital ones.
  • Reliability issues from thermo-mechanical Stress & Warpage of multi-die assemblies.

Capabilities

Power Integrity Signoff

2.5D/3D IC Electrothermal Signoff

2.5D/3D IC Electrothermal Signoff

 Ansys RedHawk-SC (digital) and Ansys Totem (analog) are the world’s leading solutions for SoC power integrity analysis. You can model supply voltage variations with foundry-verified signoff accuracy and reduce the overall power noise impact through the package and board. Current density and electromigration analysis are thermal-aware for both power supply metal and signal interconnect on chip or package layers. 

2.5D/3D IC Electrothermal Signoff

2.5D/3D IC Electrothermal Signoff

2.5D/3D IC Electrothermal Signoff

 Ansys RedHawk-SC Electrothermal provides multiphysics analysis for stacked multi-die packages for power integrity, thermal analysis, and mechanical stress/warpage – all the way from early prototyping to final signoff. This high-capacity multiphysics analysis is in full context of the entire 2.5D/3D system for maximum accuracy and to ensure system reliability. The co-simulation analysis integrates to system-level tools including Ansys Icepak and Ansys SIwave. 

RTL Power Analysis and Reduction

2.5D/3D IC Electrothermal Signoff

Electromagnetic Analysis for Silicon

 Identify power hotspots and debug their root cause interactively with a powerful graphical interface and custom queries. Reduce clock, memory, and logic power with high-impact block- and instance-level RTL techniques based on production-proven physically-aware power analysis. Profile power of real workloads rapidly and qualify coverage. 

Electromagnetic Analysis for Silicon

Electromagnetic Analysis for Silicon

 Ansys RaptorH has the capacity capacity to model power grids, full custom blocks, spiral inductors, and clock trees. Its high-speed distributed processing delivers accurate, silicon-proven S-parameter and RLCk models. RaptorH makes it easy to use either the general purpose HFSS engine or the silicon-optimized RaptorX engine. 

Electrostatic Discharge (ESD) and Substrate Noise Analysis

 Ansys PathFinder simulates human body model (HBM) and charge device model (CDM) events for static and transient silicon-correlated accuracy. It ensures ESD integrity and reduces debugging turnaround time.

Ansys Totem is a comprehensive co-simulation framework for analog, mixed-signal and custom circuit designs and provides a comprehensive full-chip solution for modeling and simulating noise injection, propagation and coupling through the on-die power grid RLC, substrate RC, and package RLC networks.

Cloud-Native Elastic Compute Architecture

 Ansys SeaScape infrastructure provides per-core scalability, flexible design data access, instantaneous design bring-up, MapReduce-enabled analytics, and many other revolutionary capabilities. With unparalleled scalability across thousands of cores using big data techniques, Ansys RedHawk-SC helps you sign off billion+ instance designs within a few hours on commodity hardware. No dedicated machines are needed. 

Ansys Electronics

Electronics Business Value

 The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs 

Electronics Design Simulation

 With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system. 

Ansys Electronics Desktop (AEDT)

 The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. 

Ansys Electronics-What's New?

 In 2024 R1, Ansys Electronics delivers capabilities that speed time to results, enable new functionalities, and expand interoperability with other Ansys products for multiphysics and multiscale solutions. Ansys HFSS 3D layout supports encrypted technology files, SIwave near fields, and Flex PCB for Layout Components. Ansys Maxwell supports Flex PCB Layout Components, which delivers a streamlined workflow for noise-vibration-harshness (NVH) and a 10-fold decrease in the simulation time of ECAD and MCAD assemblies. 

Ansys Electronics- Capabilities

Power integrity and signal integrity analysis

Electromagnetic interference and compatibility

Electromagnetic interference and compatibility

 These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices. 

Electromagnetic interference and compatibility

Electromagnetic interference and compatibility

Electromagnetic interference and compatibility

 Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.  

Wireless and RF

Electromagnetic interference and compatibility

Thermal management

 By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation,  engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs. 

Thermal management

Thermal management

 Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution 

Electric machine analysis

 Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH). 

Electronics reliability simulation

 Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design. 

Ansys Optics

End-to-End Multiphysics and Multiscale Simulation Platform

 Ansys Optics solutions offer robust design, optimization, and verification simulation software backed by world-class support. These tools empower designers to expedite the development of groundbreaking optical products while improving performance, reliability, and yield. With a suite of top-tier physics solvers, Ansys Optics provides user-friendly workflows for precise multiscale system design, from the nano to macro scale, enabling the design of diverse applications across various industries. 

Best-in-class Capabilities

  • Design, optimization, and verification of optics and photonics components, modules, circuits, and systems
  • Physics-based human perception and machine vision
  • Streamlined, automated multisolver workflows for multiscale optical system design and analysis
  • Open ecosystem and Python-based automation
  • Design for manufacturability and yield via advanced tolerancing and statistical analysis
  • Advanced optimization including inverse design and Ansys optiSLang integration

What's New

 Ansys Optics continues to push the innovation envelope to deliver accurate, high-performance simulation capabilities for optics designers. The 2024 R1 release provides powerful capabilities that speed up the time to result, improve simulation accuracy, and expand interoperability with other Ansys products. 

Copyright © 2026 Karetech - All Rights Reserved.

  • TECHNOLOGIES
  • PRODUCTS
  • Contact Us

Powered by

This website uses cookies.

We use cookies to analyze website traffic and optimize your website experience. By accepting our use of cookies, your data will be aggregated with all other user data.

Accept